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• W2536229430 abstract "A novel Al-reflow process with the electron cyclotron resonance (ECR) plasma treatment for the modification of underlayers was developed in a vacuum isolated sputtering equipment. The key feature of this technology is the introduction of the in-situ ECR plasma treatment for the modification of the surface characteristics such as surface morphology and stoichiometry of the TiN wetting/barrier layer. High wettability of the Al film was obtained on the ECR-treated TiN surface, producing a conformal Al film on the sidewall of the contact hole before the reflow process. Consequently, complete filling of contact holes with Al was achieved in deep sub-micron contact holes with a high aspect ratio. This study has demonstrated that the Al-reflow process can be extended to the process of the devices of 256 Mbit DRAM generation and beyond. >" @default.
• W2536229430 created "2016-10-28" @default.
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• W2536229430 date "2002-12-17" @default.
• W2536229430 modified "2023-09-27" @default.
• W2536229430 title "A novel Al-reflow process using surface modification by the ECR plasma treatment and its application to the 256 Mbit DRAM" @default.
• W2536229430 doi "https://doi.org/10.1109/iedm.1994.383452" @default.
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