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- W2536931495 abstract "Sn/Cu solder joints serve as electrical pathways and mechanical supports in microelectronic packaging. This study demonstrates that the Cu plating formula has a strong effect on the incorporation of impurities in the Cu deposit and, consequently, affects the microstructural evolution of the Sn/Cu interface. An additive formula with polyethylene glycol (PEG) and chloride ions (Cl−) results in a high-level incorporation of impurities (carbon, oxygen, sulfur, and chlorine) in the Cu deposit. Segregation of impurities to the Sn/Cu interface occurs during thermal aging, which induces the formation of voids and Cu-impurity compounds (CuO, Cu2O, and CuS2) embedded in the Cu6Sn5 and Cu3Sn phase layers, forming an unusual alternating layer structure that is structurally loose and unstable. The addition of bis(3-sulfopropyl) disulfide (SPS) along with PEG and Cl− helps restore the microstructural integrity of the Sn/Cu interface by suppressing the incorporation of impurities. This suppression strongly depends upon the SPS concentration and the PEG molecular weight. The aging temperature also has a significant effect on the microstructural evolution of the Sn/Cu interface, which is determined by the change of the dominant diffusion species." @default.
- W2536931495 created "2016-10-28" @default.
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- W2536931495 date "2016-01-01" @default.
- W2536931495 modified "2023-10-16" @default.
- W2536931495 title "Effects of Cu Electroplating Formulas on the Interfacial Microstructures of Sn/Cu Joints" @default.
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- W2536931495 doi "https://doi.org/10.1149/2.0091614jes" @default.
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