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- W2537200315 abstract "We demonstrate new fabrication technologies for dual-gate CMOSFETs with multiple-thickness gate oxide. The process consists of two major parts: forming a multiple-thickness gate oxide by using Ar/sup +/ and N/sup +/ implantation, and impurity doping into dual-gate poly-Si by using self-aligned thermal oxidation. During the doping process, nitrogen distribution recoiling from a Si/sub 3/N/sub 4/ on a PMOSFET gate suppresses boron penetration." @default.
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- W2537200315 date "2002-11-27" @default.
- W2537200315 modified "2023-09-24" @default.
- W2537200315 title "Multiple-thickness gate oxide and dual-gate technologies for high-performance logic-embedded DRAMs" @default.
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- W2537200315 doi "https://doi.org/10.1109/iedm.1998.746371" @default.
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