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• W2537734198 abstract "We report the feasibility and effectiveness of short voltage stress for oxide defect screen in this paper. Wafer-level in-process voltage stress rather than post-process burn-in may be necessary for defect screening, so that all the thin oxides can be accessed and higher voltage may be used to accelerate the burn-in. Oxide breakdown theory has been successfully used to model this defect control method. >" @default.
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• W2537734198 date "2002-12-17" @default.
• W2537734198 modified "2023-09-22" @default.
• W2537734198 title "Efficient gate oxide defect screen for VLSI reliability" @default.
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• W2537734198 doi "https://doi.org/10.1109/iedm.1994.383339" @default.
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