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- W2539127047 abstract "The authors present three different advanced test vehicles that help ICs and the package engineers involved in the design and development of new devices. The first is a silicon integrated circuit for mechanical stress evaluation; the second is a special metal pattern for passivation layer characterization and device metal displacement evaluation; and the last is an integrated structure for package thermal characterization. These techniques are designed to measure and quantify the effect of plastic packaging on silicon devices. >" @default.
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- W2539127047 date "2002-12-04" @default.
- W2539127047 modified "2023-09-24" @default.
- W2539127047 title "Plastic package related effects, measured by means of silicon test patterns" @default.
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- W2539127047 doi "https://doi.org/10.1109/iemt8.1990.171056" @default.
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