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- W2540552094 abstract "In this paper, we proposed new intermediate bonding layers (IBLs) of Ag-rich composition in In-Ag solder systems in contrast to previous studies mainly based on eutectic composition. The intermetallic compounds (IMCs) at the bonding interface were investigated with respect to the bonding condition, post-bonding room temperature storage and post-bonding heat treatment. The IMCs of Ag <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>2</sub> In and Ag <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>9</sub> In <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>4</sub> with high temperature resist to post-bonding process are derived under process condition of wafer bonding at 180degC, 40 mins and subsequent 120degC~130degC annealing for 24 hours. Based on our results, we can design proper packaging process flow so as to get reliable wafer level packaged MEMS devices." @default.
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- W2540552094 date "2008-10-01" @default.
- W2540552094 modified "2023-09-22" @default.
- W2540552094 title "Bonding interface materials evolution of intermediate In/Ag layers for low temperature fluxless solder based MEMS wafer level packaging" @default.
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- W2540552094 doi "https://doi.org/10.1109/emap.2008.4784267" @default.
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