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• W2541007574 abstract "This paper investigates about the noise coupling between signal TSV and active circuit in frequency domain using 3D EM solver. Because the active circuits and TSV are generally surrounded by deep N-well and substrate ties, some parameters related to dimension parameters of those are varied to clarify the tendency, and the results are explained qualitatively. After that, using S-parameter, simple MOS application is simulated in time domain simulation." @default.
• W2541007574 created "2016-11-04" @default.
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• W2541007574 date "2012-12-01" @default.
• W2541007574 modified "2023-09-26" @default.
• W2541007574 title "Noise coupling analysis between TSV and active circuit" @default.
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• W2541007574 doi "https://doi.org/10.1109/edaps.2012.6469428" @default.
• W2541007574 hasPublicationYear "2012" @default.
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