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- W2541037476 abstract "We developed a hole shrink process named RELACS (Resolution Enhancement Lithography Assisted by Chemical Shrink) that is a robust and low-cost method. This method makes use of crosslinking reaction between the materials coated on the resist pattern, and the acid existing at the resist wall. By the RELACS, we could shrink KrF resist hole patterns to 0.1 /spl mu/m level. The shrinkage of hole size is dependent on both baking temperature and initial hole size. This process has been established for the fabrication of 0.20 /spl mu/m devices." @default.
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- W2541037476 date "2002-11-28" @default.
- W2541037476 modified "2023-09-26" @default.
- W2541037476 title "0.1 μm level contact hole pattern formation with KrF lithography by resolution enhancement lithography assisted by chemical shrink (RELACS)" @default.
- W2541037476 doi "https://doi.org/10.1109/iedm.1998.746367" @default.
- W2541037476 hasPublicationYear "2002" @default.
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