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• W2542248364 abstract "The effect of transition metal (TM) additive of Ni, Co or Zn on the interfacial reactions of the solder joints between Sn-Ag-Cu (SAC) solder and the Cu/Ni(P)/Au substrate was investigated, especially when subsequent to multi-reflowing. (Cu,Ni) <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>6</sub> Sn <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>5</sub> formed at the interface of all the joints but the SAC-Ni of which the interfacial compound was (Ni,Cu) <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>6</sub> Sn <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>5</sub> . The interfacial compounds of the SAC-Co and SAC-Zn contained a small amount of alloying elements of less than 3at%. Two P-rich layers, Ni <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>3</sub> P and Ni-Sn-P were found have emerged at the interface of the SAC joints. Nanoindentation analysis indicates that the hardness and Young's modulus of these two phases were slightly higher than Ni(P) substrate, which were in turn much greater than Cu-Ni-Sn compounds. Worthy of notice is that with TM additions the Ni-Sn-P phase between Ni <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>3</sub> P and interfacial compounds was absent even after 10-time reflows. For the SAC-Co joints, the growth of Ni-containing intermetallic compounds (IMCs) within the solder gave rise to the excess Ni dissolution which caused a discrete Ni <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>3</sub> P layer and over-consumed Ni(P) substrate underneath the grooves in-between (Cu, Ni) <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>6</sub> Sn <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>5</sub> scallop grains at the interface." @default.
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• W2542248364 date "2008-10-01" @default.
• W2542248364 modified "2023-10-16" @default.
• W2542248364 title "Effect of transition metals on the interfacial reactions in electroless Ni(P)-solder interconnections" @default.
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• W2542248364 doi "https://doi.org/10.1109/emap.2008.4784282" @default.
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