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- W2543409690 abstract "For the first time, a highly manufacturable fin-channel array transistor (FCAT) on a bulk Si substrate has been successfully integrated in a 512 M density DRAM with sub-70nm technology. The FCAT shows an excellent short channel behavior, such as extremely low subthreshold swing (SS) (/spl sim/75mV/dec) and DIBL (/spl sim/13mV/V), and a high cell transistor drive current with remarkably low subthreshold leakage current (/spl sim/0.2fA/cell)." @default.
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- W2543409690 date "2004-03-22" @default.
- W2543409690 modified "2023-09-23" @default.
- W2543409690 title "Fin-channel-array transistor (FCAT) featuring sub-70nm low power and high performance DRAM" @default.
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- W2543409690 doi "https://doi.org/10.1109/iedm.2003.1269309" @default.
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