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• W2545138962 abstract "In this paper, experimental methods to characterize the electrical and thermal package properties of newly developed MOSFET technology demonstrators are discussed. The electrical measurements focus on the switching characteristics and the stray inductance. From the thermal point of view, the steady-state temperature distribution within the package is measured. Exemplarily, measurement results for the FlipChip on Flex technology applying low-voltage, high current MOSFETs are used for the evaluation." @default.
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• W2545138962 date "2007-09-01" @default.
• W2545138962 modified "2023-09-30" @default.
• W2545138962 title "Experimental characterization methods for power MOSFET assemblies" @default.
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• W2545138962 doi "https://doi.org/10.1109/epe.2007.4417633" @default.
• W2545138962 hasPublicationYear "2007" @default.
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