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- W2546283485 abstract "In this research, bump-shaped Vertically Aligned Multi-walled Carbon Nanotubes (VA-CNTs) were bonded to Au substrate as flip-chip interconnect, and the behaviors of the VA-CNT bumps under compression pressure were studied. The resistance of the bonded VA-CNT bumps with load was decreased under compression pressure. In this model, it is considered that the VA-CNTs were deformed permanently by the friction among the VA-CNTs. In order to solve the cause of the permanent deformation of the VA-CNT bumps, the friction among the CNTs during the compression is calculated." @default.
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- W2546283485 date "2012-12-01" @default.
- W2546283485 modified "2023-10-02" @default.
- W2546283485 title "Electrical properties of flexible Vertically aligned Carbon Nanotube bumps under compression" @default.
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- W2546283485 doi "https://doi.org/10.1109/icsj.2012.6523404" @default.
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