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• W2548483463 abstract "The detection of the junction temperature of power electronic devices during operation plays a central role in reliability and thermal management strategies. The on-state voltage as a TSEP (temperature sensitive electrical parameters) has advantages in terms of applicability and sensitivity to other approaches but it is influenced by the terminal connection voltage. This paper will develop a real-time model for the mean temperature of wire bondings." @default.
• W2548483463 created "2016-11-11" @default.
• W2548483463 creator A5004488088 @default.
• W2548483463 creator A5089838275 @default.
• W2548483463 date "2016-09-01" @default.
• W2548483463 modified "2023-09-26" @default.
• W2548483463 title "Temperature estimation for wire bondings in power semiconductor devices" @default.
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• W2548483463 doi "https://doi.org/10.1109/epe.2016.7695579" @default.
• W2548483463 hasPublicationYear "2016" @default.
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