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- W2550592481 abstract "The fabrication procedures to contact the carbon nanotubes (CNT) to metal surface determine the contact resistance of the CNT bump. The large contact resistance is seen as a limiting factor to realize practical application using CNT bumps. An alternative bonding solution using CNT in physical contact with CNT using CNT interconnection bump is proposed. A study was conducted to determine the relationship between the bonding loads and bump resistances. It was concluded that the bump resistance decreases exponentially with the bonding load due to the change in inter-tube spacing. The lowest achieved CNT interconnection bump resistivity value was 0.05 Ω.cm." @default.
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- W2550592481 date "2011-12-01" @default.
- W2550592481 modified "2023-10-16" @default.
- W2550592481 title "Characterization of CNT interconnection bumps implemented for 1st level flip chip packaging" @default.
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- W2550592481 doi "https://doi.org/10.1109/eptc.2011.6184414" @default.
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