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- W2550807849 abstract "Heat pipes have the advantage of transferring large amounts of heat between reservoirs with small temperature dierences which makes them preferable for electronics cooling applications. Micro-grooved heat pipes promise the additional advantage of being adaptable to systems which need to be cooled with minimal contact resistance. In this study, a multi-physics computational model is developed to assess the thermal performance of a silicon-based micro-grooved heat pipe. The microuidic platform consists of 50 rectangular micro-grooves on a silicon wafer with integrated chromium (Cr) microheaters. The phase change occurring within the micro-groove is included in the model as a convective heat transfer boundary condition at the channel wall. The convective heat transfer coefcients are obtained from another detailed study in which the 3-D heat transfer process in the solid and working uid coupled with a 1-D analysis of" @default.
- W2550807849 created "2016-11-30" @default.
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- W2550807849 date "2015-01-01" @default.
- W2550807849 modified "2023-09-23" @default.
- W2550807849 title "MULTI-PHYSICS MODELING OF SILICON-BASED MICRO-GROOVED HEAT PIPE" @default.
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