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• W2565061812 abstract "Abstract In this study, a new Cu(TiBN x ) alloy film has been explored and utilized as a flexible heat dissipation layer for the substrate of high power LEDs to boost their per-watt illuminance by reducing the thermal resistance and increasing the thermal conductivity of the substrate. The new film is a Cu-alloy seed layer fabricated by co-sputtering Cu and TiB in an N 2 atmosphere on a Ta/polyimide (Ta/PI) substrate. The film was then annealed at 340 °C for 1 h without noticeable Cu oxide formation around the film-substrate interface. The new film exhibits low resistivity, high thermal conductivity and low thermal resistance, rendering a substantially higher per-watt illuminance for LEDs that utilize the film as their additional heat dissipation layer. The experimental results gained in the study appear to confirm the new Cu(TiBN x ) film as a good candidate material, at least, for boosting the per-watt illuminance of high power LEDs." @default.
• W2565061812 created "2017-01-06" @default.
• W2565061812 creator A5010285135 @default.
• W2565061812 date "2016-12-12" @default.
• W2565061812 modified "2023-10-18" @default.
• W2565061812 title "A new Cu(TiBN_x) alloy film for boosting the per-watt illuminance of high power LEDs" @default.
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• W2565061812 doi "https://doi.org/10.7567/jjap.56.01ab09" @default.
• W2565061812 hasPublicationYear "2016" @default.
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