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• W2565375122 abstract "In the era of deep-nanoscale transistors, 3D structure of a FinFET strengthens the self-heating effect (SHE) that intensifies aging degradation. However, unlike planar devices, heat in FinFETs can improve the circuit performance due to the temperature effect inversion (TEI). This work investigates the impact of bias temperature instability (BTI) on long-term circuit performance in the presence of TEI. To accurately evaluate the device delay, the proposed unified TEI and BTI model takes into consideration temperature variation extracted from power dissipation in the device. The experimental results are carried out through selected combinational benchmark circuits under temperature and frequency variations. Compared to other recent approaches, this proposed method provides highly optimistic results in which either performance degradation (up to 2.3%) or improvement (up to 10%) can be found. Further, the results reveal that performance degradation due to the integration of BTI and TEI tends to worsen at high temperature, yet weaken at high frequency." @default.
• W2565375122 created "2017-01-06" @default.
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• W2565375122 date "2016-11-01" @default.
• W2565375122 modified "2023-10-01" @default.
• W2565375122 title "Combined Impact of BTI and Temperature Effect Inversion on Circuit Performance" @default.
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• W2565375122 doi "https://doi.org/10.1109/ats.2016.34" @default.
• W2565375122 hasPublicationYear "2016" @default.
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