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- W2565417167 abstract "Direct bonded copper (DBC) substrates are widely used in electronic power devices to enable high electric currents and to electrically isolate silicon dies from the heat sinks. DBC substrates are copper/ceramic/copper composites. They exhibit residual stresses after their bonding process caused by the CTE mismatch between copper and ceramics. In automotive applications, electronic power devices experience high temperature variations, which can lead to cracking in the DBC ceramic. As a consequence, the resulting diminished heat dissipation inevitably will lead to failure in the power device. Thus a lifetime model to predict the rate of cracking is very helpful." @default.
- W2565417167 created "2017-01-06" @default.
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- W2565417167 date "2016-09-01" @default.
- W2565417167 modified "2023-09-26" @default.
- W2565417167 title "Novel concepts for modelling and enhancing the DBC-Al<inf>2</inf>O<inf>3</inf> lifetime" @default.
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- W2565417167 doi "https://doi.org/10.1109/estc.2016.7764676" @default.
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