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- W2565688328 abstract "In this paper we will study different approaches in order to reduce the risk of failures in the Back-End-of-Line (BEOL) going from the reinforcement of the BEOL itself to the design of the under bump pad with soft and stiff materials. This work is done by combining Finite Element Models (FEM) and the analysis of failures after a mechanical shear tests of copper pillars with different under bump pad designs. A dedicated test chip with a BEOL of 4 metal layers is designed and built with a minimum pitch of 90 nm and a metal thickness aspect ratio of 1 for the first two metal layers where advanced low-k materials with k ≤ 2.4 are used. The impact of via densities is assessed. The experimental shear test results demonstrate that a thick passivation, although reduces the stresses in the lower layers of the BEOL, may induce early failures due to a crack in the passivation that propagate towards lower layers of BEOL. This crack growing process can be explained by the numerical modeling where it is found that there is a high residual stress in the base of the aluminum pad due to the deposition of the passivation layer on top of the aluminum." @default.
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- W2565688328 date "2016-09-01" @default.
- W2565688328 modified "2023-10-02" @default.
- W2565688328 title "Methodologies to mitigate package induced stresses in the BEOL" @default.
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- W2565688328 doi "https://doi.org/10.1109/estc.2016.7764490" @default.
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