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- W2566172573 abstract "This work presents the glass reflow process for microsystems. In this process, glass compounded silicon structures are achieved with the help of vacuum cavities under a high temperature. Three applications employing the glass reflow process, through-wafer interconnects, thermal isolation, and optical window, have been proposed and investigated." @default.
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- W2566172573 date "2016-04-01" @default.
- W2566172573 modified "2023-09-26" @default.
- W2566172573 title "Glass reflow process and its applications" @default.
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- W2566172573 doi "https://doi.org/10.1109/nems.2016.7758246" @default.
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