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- W2566794003 abstract "Abstract The thermal imidization process of 1,2,4,5-benzenetetracaboxylic (PMDA)/4,4’-diamnodiphenyl ether (4,4′-ODA) solutions in N -methyl-2-pyrrolidone (NMP) from polyimide (PI) precursor, poly (amic acid) (PAA), was systematically investigated through a series of characterization methods, such as Fourier transform infrared spectroscopy (FT-IR), thermogravimetric analysis (TGA), differential scanning calorimetry (DSC), and dynamic mechanical analysis (DMA). At the low-temperature drying stage, mechanical properties and T g of polymer films were increased as a result of solvent removal. TGA method was used to quantitatively monitor the evaporations of hydrogen-bonded solvents on PAA and of the dehydration during the imidization reaction that occurred above 150 °C. During the imidization stage, the interplay between the solvent evaporation and the imidization was the key factor that determined the enhancement of the mechanical properties and T g . The degree of imidization approached 94% when the temperature was increased to 250 °C. A “complete” imidization was achieved by annealing between 350 and 400 °C. The enhancement in the mechanical properties of final PI films may result from the increased T g and the crystallized structure formed during the annealing stage." @default.
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- W2566794003 date "2017-01-01" @default.
- W2566794003 modified "2023-10-03" @default.
- W2566794003 title "Thermal imidization process of polyimide film: Interplay between solvent evaporation and imidization" @default.
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- W2566794003 doi "https://doi.org/10.1016/j.polymer.2016.12.037" @default.
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