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- W2566981323 abstract "The change of electrical resistivity of polycrystalline copper of various purities was measured during tensile deformation. The purity of material did not substantially influence the results. With the use of intermediate annealing, the contributions of point defects and dislocations to the total resistivity increment were separated. The linear relationship between the stress and square root of the dislocation density was found. The Saada's relation was checked and found to be valid only in the case of point defects produced in originally annealed copper. l. INTRODUCTION The microscopic explanation of the work hardening of metals is based on the mutual interaction of lattice defects. In order to understand the mechanism of work hardening, many authors tried to relate flow stress or strain to other physical properties of crystals that are in direct relation to the created defects. In addition to direct observation of defects in electron microscope, by X-ray topography or using the etch-pits, some indirect methods are often used. One of these methods, which allows to follow the density of both line and point defects in a broad concentration range, is the resistometric method. In the initial work done by van Bueren and his collaborators [1] the increment of electrical resistivity of polycrystalline wires with strain was investigated and the results were analysed with the use of the power law. Along this line Peiffer [2, 3] investigated the influence of predeformation on the values of the exponent. Pry and Hennig [4] showed, however, that the effect of previous history can be taken into account by relating the increment of resistivity with the stress. Blewitt, Coltman and Redman [5] by measuring the stress strain curves and the electrical resistivity on copper single crystals have found that the increment of resistivity due to dislocations is proportional to the square of the shear stress. Detailed measurements on copper single crystals by Saimoto and Basinski [6] proved this result. Moreover the point defect resistivity at higher values of strain was proportional to the cube of the shear stress. In the initial region appreciable dependence of the resistivity increment on the purity of the material was found. Investigations of changes of the electrical resistivity of polycrystalline copper at high degree of deformation in torsion experiments [7, 8] showed the proportionality *) Present address: Institute of Physics, CzeehosL Acad. Sei., Na Slovanee 2, Praha 8, Czechoslovakia. **) ,#.i~kova 22, Brno, Czechoslovakia." @default.
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- W2566981323 date "1972-01-01" @default.
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- W2566981323 title "CHANGE OF ELECTRICAL RESISTIVITY OF POLYCRYSTALLINE COPPER" @default.
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