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- W2577778915 abstract "In electronic products, lately increasing thermal radiation is demanding higher thermal conductivity of polymer composites. However, inaccurate observation of filler dispersion within the polymer do not allow for accurate quantification of Interface Thermal Resistance and subsequently prediction of thermal conductivity. Therefore optimum filler design could not be achieved. Firstly in this report, accurate stereoscopic filler dispersion was observed by FIB-SEM. Secondly, quantification of Interface Thermal Resistance could be achieved by thermal conduction analysis using filler dispersion model. Thirdly, this Interface Thermal Resistance enabled prediction of the thermal bulk conductivity. Lastly, prediction made above could be validated by comparison of predicted value and measured value. This result may lead to optimum filler design and thereby to the development of higher thermal radiation materials." @default.
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- W2577778915 date "2014-01-01" @default.
- W2577778915 modified "2023-09-26" @default.
- W2577778915 title "A Study of Interface Thermal Resistance and Bulk Thermal Conductivity by Observation of Stereoscopic Filler Dispersion in Polymer Composites" @default.
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- W2577778915 doi "https://doi.org/10.7791/jspmee.3.199" @default.
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