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- W2585308009 abstract "The effect of various surface finishes on the interfacial fracture toughness of SAC405 solder joints under shock loading conditions was investigated using sandwich compact tension specimens. The surface finishes investigated in this study were organic solderability preservative (OSP), immersion silver (ImAg), nano-tin dispersed in an organic carrier (OrM), and gold over nickel (NiAu). It was found that the ImAg surface finish appears to enhance the fracture toughness, while the NiAu surface finish appears to have no effect compared to bare copper. For the OSP and OrM surface finishes, more data will need to be collected to reach a conclusion regarding their effect. The effects on fracture toughness could not be attributed to the thickness or morphology of the intermetallic compound layer found at the solder joint interface. Future work will focus on understanding the mechanisms by which immersion silver enhances the fracture toughness. Overall, the results of this study may help designers make more informed decisions about which surface finishes can be used to reduce shock failures in consumer electronic devices." @default.
- W2585308009 created "2017-02-10" @default.
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- W2585308009 date "2017-01-01" @default.
- W2585308009 modified "2023-09-26" @default.
- W2585308009 title "Surface Finish Effects on Fracture Behavior of Sn–4Ag–0.5Cu Solder Joints" @default.
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- W2585308009 doi "https://doi.org/10.1007/978-3-319-51097-2_19" @default.
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