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- W2588707266 abstract "This paper proposes a wire-bonded design with a unique double-end sourced structure for multi-chip paralleled SiC power modules. The proposed design achieved a reduced power-loop inductance of 7.2 nH, while inheriting the advantages of the conventional wire-bond technology. More importantly, the symmetrical structure of the proposed design brought consistent performances to the paralleled devices. A 1200 V, 60 A SiC MOSFET half-bridge module (3 devices in parallel) was fabricated and tested for verification. It demonstrated suppressed voltage overshoot and improved current-sharing among the devices. In addition, the proposed layout exhibited lower radiation noises, which will cause less interference to the sensitive electronic devices. A converter level design is also presented to accommodate this unique module structure." @default.
- W2588707266 created "2017-02-24" @default.
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- W2588707266 date "2016-09-01" @default.
- W2588707266 modified "2023-09-24" @default.
- W2588707266 title "An improved wire-bonded power module with double-end sourced structure" @default.
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- W2588707266 doi "https://doi.org/10.1109/ecce.2016.7854848" @default.
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