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- W2592307266 abstract "In this paper, we presented a wafer-level encapsulated Thermoresistive Micro Calorimetric Flow (TMCF) sensor with the integrated packaging by using the proprietary InvenSense CMOS MEMS technology. For the nitrogen gas flow from −26m/s to 26m/s, the pulsed operated TMCF sensor (device size = 3.4mm2) under the Constant Temperature Difference (CTD) mode achieved a normalized sensitivity of 112.4μV/(m/s)/mW with respect to the input heating power. Besides, the measured TMCF sensor response time (τ max <3.63ms) shows good agreement with a theoretical model. With the pulsed operation, the proposed low-power TMCF sensor will be a promising digital CMOS MEMS flow sensor for the Internet of Things (IoT), especially for smart building/home." @default.
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- W2592307266 date "2017-01-01" @default.
- W2592307266 modified "2023-09-29" @default.
- W2592307266 title "A wafer-level encapsulated CMOS MEMS thermoresistive calorimetric flow sensor with integrated packaging design" @default.
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- W2592307266 doi "https://doi.org/10.1109/memsys.2017.7863577" @default.
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