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- W2593227675 abstract "An advanced micromachining process has been developed to further push the performance limits of mass-produced inertial MEMS. The main achievement of the new platform technology is the usage of two independent silicon layers instead of one to form, e.g., masses, springs, and free-standing electrodes. This dual layer process option opens the path towards new 3D-like sensor topologies with improved performance and smaller form-factors. The first accelerometer generations using this technology are being manufactured for automotive and CE applications. One of the key features of these new devices is their unparalleled offset stability which they maintain even in stress-affected mold packages." @default.
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- W2593227675 date "2017-01-01" @default.
- W2593227675 modified "2023-10-01" @default.
- W2593227675 title "Advanced surface micromachining process — A first step towards 3D MEMS" @default.
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- W2593227675 doi "https://doi.org/10.1109/memsys.2017.7863404" @default.
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