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• W2600346950 abstract "Wafer overlay errors due to EUV mask non-flatness and thickness variations need to be minimized for the successful deployment of EUV lithography at N7 HVM. In this paper, we provide an updated assessment of the overlay impacts from EUV mask blanks as relevant to N7. We then evaluate the effectiveness of high-order scanner correction and mask compensation in minimizing the mask blank induced overlay to meet the allocated N7 overlay budget. Various scenarios for combining the compensation methods are evaluated, and a practical EUV mask flatness and thickness variation specification for N7 production is proposed." @default.
• W2600346950 created "2017-04-07" @default.
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• W2600346950 date "2017-03-24" @default.
• W2600346950 modified "2023-09-23" @default.
• W2600346950 title "Minimizing wafer overlay errors due to EUV mask non-flatness and thickness variations for N7 production" @default.
• W2600346950 doi "https://doi.org/10.1117/12.2258642" @default.
• W2600346950 hasPublicationYear "2017" @default.
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