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• W2600642542 abstract "This research conducted a study on the SEF electrode formation method to replace the Ag screen printing method in order to enhance the capability of the solar cell. For the formation of electrode, Cu, which is a metal with high conductivity and relatively cheap cost, was applied as the main electrode by using electroless Ni plating solution and electroless Cu plating solution, and the process of forming Ni was applied to prevent spreading. By evaluating the selective characteristics of Si and ARC layer of such Ni/Cu electroless plating process, the method to form electrode without PR patterning was studied. Such electrode formation method forms electrodes through electroless plating, having the benefit of forming electrode without high-cost equipments within a short time period, and is expected to be an electrode formation technique of low-cost and high-efficiency that can be industrialized. For this research, the SEF device was designed, the refined structure and shape of the plating layer according to plating conditions were observed, and the characteristics of selective deposition to replace current Ag screen printing method is to be evaluated. The metallic electrode within a silicon solar cell is one of the factors that influence the determination of the cell’s efficiency and cost. Resistance is an example of one of the most influential factors that reduces the efficiency of a solar cell, and the reduction due to the substance of resistance includes resistance by the carrier that flows from the emitter to the direction of the metallic electrode, and a series resistance related to the contact resistance, metallic electrode, and the board. Hence, it is one of the methods to create effective overall electrode at a low cost with maximum efficiency. The screen printing method, which is currently being most widely used commercially, is very costly as it relies on import, and had a disadvantage that it has a long firing time as it uses follow-up firing devices. The silver paste application screen printing method, which is usually used for such screen printing, is very sensitive to the firing variables such as temperature, gas, pressure and etc. during the heat treatment firing due to the characteristics of the ingredients and faces the problem of not being able to minimize the design of the bus bar or finger bar of the solar cell. Hence, there needs to be an alternate technology to electrode material and the method of formation. Hereupon, among the methods that are being widely used to manufacture highly efficient solar cells, the method of Ni/Cu plating which vapor plates metallic electrode is cheap and Cu has high conductivity. Also it is appropriate for Cu’s role as a diffusion barrier. Thus, if the electroless plating selective plating continuous process that uses the Ni/Cu metallic electrode instead of Ag paste, it would be easier to produce high-efficient cells and a low cost. Electroless Ni acts as a seed layer for electroless Cu plating, making the adhesion between the silicon board and the Cu electrode strong, thus improving the mechanic and electronic characteristics of the board and the electrode; and also acts as a diffusion barrier that prevents the Cu from spreading onto the silicon board. Also, when heated at around 400~600 °C, Ni" @default.
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• W2600642542 date "2011-01-01" @default.
• W2600642542 modified "2023-09-25" @default.
• W2600642542 title "High Efficiency and Low Cost Solar Cell Electrode Using Selective Electrode Formation Process" @default.
• W2600642542 doi "https://doi.org/10.1149/ma2011-02/2/56" @default.
• W2600642542 hasPublicationYear "2011" @default.
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