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- W2604582208 abstract "The microstructure resulting from diffusion reactions, at solid-state temperatures, in Ni/Sn couples has been studied by scanning electron microscopy (SEM) and energy dispersive X-ray (EDX). The Ni 3 Sn 4 phase was the only reaction product which formed in the couples at temperatures from 150[Formula: see text]C to 220[Formula: see text]C. The growth kinetics of Ni 3 Sn 4 layer followed the parabolic law with an apparent activation energy of 104[Formula: see text]kJ[Formula: see text]mol[Formula: see text]. The effect of the atmosphere on the microstructure of the interfacial layer was investigated at 220[Formula: see text]C for a pressure of 10[Formula: see text][Formula: see text]atm. A decrease in the growth rate of the phase layer was observed." @default.
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- W2604582208 date "2017-11-01" @default.
- W2604582208 modified "2023-09-23" @default.
- W2604582208 title "INTERMETALLIC COMPOUND FORMATION IN Ni/Sn DIFFUSION COUPLE AT ATMOSPHERIC AND AT 10−8 ATMOSPHERE PRESSURE" @default.
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- W2604582208 doi "https://doi.org/10.1142/s0218625x18500233" @default.
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