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- W2604596739 abstract "The central role of packaging in the Chip — Package — Board trilogy makes it a prime target to solve system problems and to blame for density, performance, and cost issues. This talk discusses developments and trends in IC packaging over the past three decades from a background of electrical design and analysis coupled with an appreciation for the other disciplines involved. Electrical challenges over the years are discussed, touching on some of the contrasts between computer server and a mobile applications. Thoughts on selected current and near future challenges in electrical design and analysis are presented." @default.
- W2604596739 created "2017-04-14" @default.
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- W2604596739 date "2016-01-01" @default.
- W2604596739 modified "2023-09-25" @default.
- W2604596739 title "Industry session III: Reflections on three decades of packaging and electrical analysis" @default.
- W2604596739 doi "https://doi.org/10.1109/edaps.2016.7893099" @default.
- W2604596739 hasPublicationYear "2016" @default.
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