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• W2605993307 abstract "Chemically strengthened glass used for smartphones and tablets is cut into elaborate shapes by creating internal cracks using femtosecond laser pulses. The peak power is set at near ionization intensities of ∼1014 W/cm2 to initiate sub-surface cracks by strong nonlinear absorption underneath the stress-compressed glass surface at a 560 μm depth. Then sub-surface cracks are laterally guided with a feed-rate of 5–40 mm/s to realize accurate cutting along tensile-residual-stress lines formed around the material-modified zone inside the glass substrate. The cutting plane maintains a mirror-like cross-section profile without excessive flaws and thermal damage usually seen in conventional laser ablation." @default.
• W2605993307 created "2017-04-28" @default.
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• W2605993307 date "2017-01-01" @default.
• W2605993307 modified "2023-10-16" @default.
• W2605993307 title "Damage-free cutting of chemically strengthened glass by creation of sub-surface cracks using femtosecond laser pulses" @default.
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• W2605993307 doi "https://doi.org/10.1016/j.cirp.2017.04.071" @default.
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