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- W2606424158 abstract "Toxic aspects of lead limit the use of traditional lead-basedsolders and stimulate the development of new, lead-free joiningmaterials for microelectronics [1]. The emergence of siliconcarbide-based electronic devices, operating at hightemperatures, has initiated the investigation of alternative,high-melting-point joining materials and novel solderingapproaches [2]. Nanoscale silver pastes are promising joiningmaterials due to their low sintering temperature [3]. Thesematerials can be used for soldering at temperatures below 300stC without the need of an externally applied pressure. Oncesintered, the silver joints have a high thermal and electricalconductivity and a high melting point of bulk silver. In thepresent work, the shear strength and fracture surfacemorphology of nano-silver-copper joints have been investigated.The silver nanoparticles were prepared by a controlled thermaldecomposition of silver bis(dodecylamin)nitrate in argon. Theprepared nanoparticles were spherical, with a uniform particlesize distribution and an average particle size diameter of 8.5nm. The copper-nano-silver solder joints were prepared byplacing a small amount of nano-silver paste between twopolished copper plates. The samples were sintered at 200 – 350stC. Different external pressures were applied during sinteringand their effects on the shear strength were investigated. Thelap-shear test was performed at room temperature by imposing auniform stress across the sample bond area and measuring thecorresponding strain. The highest shear strength was observedfor samples sintered at 220 stC. The external pressure, appliedduring sintering, was found to have a positive effect on boththe materials shear strength and Young modulus. The results arecompared to previously published studies of different nano-Agpastes." @default.
- W2606424158 created "2017-04-28" @default.
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- W2606424158 date "2013-02-22" @default.
- W2606424158 modified "2023-09-26" @default.
- W2606424158 title "Mechanical properties of nano-silver – copper solder joints" @default.
- W2606424158 hasPublicationYear "2013" @default.
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