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- W2608497624 abstract "The effect of silicon (Si) particles addition on the melting temperature, intermetallic compound (IMC) layer formation and solderability of Sn-Cu-Ni solder joint were investigated. The melting temperature of mixture solder paste was studied by using Differential Scanning Calorimeter (DSC). Solderability of solder paste was evaluated through the contact angle of solder paste on Cu substrate. The interfacial morphology of monolithic and composite solder paste was characterized metallographically. The wettability and IMC thickness of Sn-Cu-Ni composite solder paste was reduced compared to the monolithic solder paste. Overall, the Si particles improved the physical properties and solderability of Sn-Cu-Ni composite solder paste." @default.
- W2608497624 created "2017-05-05" @default.
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- W2608497624 date "2017-01-01" @default.
- W2608497624 modified "2023-09-23" @default.
- W2608497624 title "Effect of silicon (Si) particles addition on melting temperature, intermetallic compound formation and solderability of Sn-Cu-Ni composite solder paste" @default.
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- W2608497624 doi "https://doi.org/10.1063/1.4981850" @default.
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