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- W2612608885 abstract "In this paper, we present an alloy via-filling method that does not need pre-metallization of via holes and can be realized on wafer level. Through-Silicon Via(TSV)/Through Glass Via(TGV) with different geometries can be filled simultaneously in few minutes, instead of few hours by electroplating. A specific equipment is made for the alloy via-filling method. The alloy TSV filling method presented in this paper has the potential for industrial applications." @default.
- W2612608885 created "2017-05-19" @default.
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- W2612608885 date "2017-03-01" @default.
- W2612608885 modified "2023-09-27" @default.
- W2612608885 title "A fast and low-cost TSV/TGV filling method" @default.
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- W2612608885 doi "https://doi.org/10.1109/cstic.2017.7919862" @default.
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