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• W2612929960 abstract "To achieve robust SiC-MOSFET, reliability of the gate insulator was investigated in terms of gate electrode edge treatment. Analytical calculation showed that r should be larger than the thickness of gate insulator to relax the electric field concentration. We obtained the rounded gate edge by dry oxidation at 1000°C, while oxidation at 800°C had it sharpened. Former samples exhibited low leakage current with Time-Zero-Dielectric-Breakdown (TZDB) measurement. I g consisted of Fowler-Nordheim (FN) tunneling current for V g > 0, and it includes excess components for V g < 0. We confirmed that they occurred at the gate edge and that they coursed positively charged trap centers in oxide near poly-Si/SiO 2 interface which caused local barrier lowering. Electron injection removed them by tunneling/recombination process, which followed tunneling-front model." @default.
• W2612929960 created "2017-05-19" @default.
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• W2612929960 date "2017-05-01" @default.
• W2612929960 modified "2023-09-27" @default.
• W2612929960 title "Analysis Self-Healing of Gate Leakage Current due to Oxide Traps to Improve Reliability of Gate Electrode" @default.
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• W2612929960 doi "https://doi.org/10.4028/www.scientific.net/msf.897.541" @default.
• W2612929960 hasPublicationYear "2017" @default.
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