Matches in SemOpenAlex for { <https://semopenalex.org/work/W2616999522> ?p ?o ?g. }
- W2616999522 endingPage "D462" @default.
- W2616999522 startingPage "D457" @default.
- W2616999522 abstract "Impurity incorporation in the Cu electrodeposits as a result of the addition of organic additives in the Cu plating solution is investigated with four additive formulas. A common suppressor (polyethylene glycol, PEG) and chloride ions (Cl−) are added in the plating solution as a control additive formula. Three organosulfides, 3-mercaptopropanesulfonsäure (MPS), bis(3-sulfopropyl) disulfide (SPS), and 3-(2-benzthiazolylthio)-1-propanesulfonsäure (ZPS), are used as accelerators and individually formulated with PEG and Cl− as the other three experimental formulas. The additive formulas of PEG + Cl− and PEG + Cl− + ZPS result in high-level impurity incorporation and cause the microstructural instability of the Sn/Cu joints during thermal aging. Voids and Cu-impurity compounds (CuO and CuS2) are formed accompanying the growth of the intermetallic compounds (Cu6Sn5 and Cu3Sn) which severely degrades the Sn/Cu joints mechanically. When the additive formulas are changed to PEG + Cl− + MPS and PEG + Cl− + SPS, the impurity incorporation is significantly suppressed and thereby inhibits the formation of voids and Cu-impurity compounds. The strong dependence of additive formulas on the impurity incorporation is attributable to the delicate interaction (adsorption competition) between suppressor (PEG) and various accelerators, in which the molecular structures of the organosulfides play a key role." @default.
- W2616999522 created "2017-06-05" @default.
- W2616999522 creator A5006338687 @default.
- W2616999522 creator A5007857979 @default.
- W2616999522 creator A5028504321 @default.
- W2616999522 creator A5045316695 @default.
- W2616999522 creator A5061314483 @default.
- W2616999522 creator A5076675483 @default.
- W2616999522 creator A5090638822 @default.
- W2616999522 date "2017-01-01" @default.
- W2616999522 modified "2023-10-11" @default.
- W2616999522 title "Impurity Incorporation in the Cu Electrodeposit and Its Effects on the Microstructural Evolution of the Sn/Cu Solder Joints" @default.
- W2616999522 cites W1545464916 @default.
- W2616999522 cites W187352343 @default.
- W2616999522 cites W1973738553 @default.
- W2616999522 cites W1990043123 @default.
- W2616999522 cites W1996654684 @default.
- W2616999522 cites W2003154977 @default.
- W2616999522 cites W2019851364 @default.
- W2616999522 cites W2026544660 @default.
- W2616999522 cites W2027228089 @default.
- W2616999522 cites W2029138948 @default.
- W2616999522 cites W2031542664 @default.
- W2616999522 cites W2033880482 @default.
- W2616999522 cites W2036137359 @default.
- W2616999522 cites W2036618770 @default.
- W2616999522 cites W2037214200 @default.
- W2616999522 cites W2046334408 @default.
- W2616999522 cites W2061437405 @default.
- W2616999522 cites W2074583725 @default.
- W2616999522 cites W2091834319 @default.
- W2616999522 cites W2093126428 @default.
- W2616999522 cites W2094727110 @default.
- W2616999522 cites W2101951025 @default.
- W2616999522 cites W2103437574 @default.
- W2616999522 cites W2110641793 @default.
- W2616999522 cites W2117399063 @default.
- W2616999522 cites W2126503149 @default.
- W2616999522 cites W2136175520 @default.
- W2616999522 cites W2142396072 @default.
- W2616999522 cites W2146879518 @default.
- W2616999522 cites W2154602891 @default.
- W2616999522 cites W2158893668 @default.
- W2616999522 cites W2161457407 @default.
- W2616999522 cites W2169322929 @default.
- W2616999522 cites W2185166758 @default.
- W2616999522 cites W2245990826 @default.
- W2616999522 cites W2320782435 @default.
- W2616999522 cites W2409237233 @default.
- W2616999522 cites W2463584121 @default.
- W2616999522 cites W2536931495 @default.
- W2616999522 cites W2555371671 @default.
- W2616999522 cites W2556683044 @default.
- W2616999522 cites W2563340979 @default.
- W2616999522 cites W328868939 @default.
- W2616999522 cites W80179075 @default.
- W2616999522 doi "https://doi.org/10.1149/2.1171707jes" @default.
- W2616999522 hasPublicationYear "2017" @default.
- W2616999522 type Work @default.
- W2616999522 sameAs 2616999522 @default.
- W2616999522 citedByCount "21" @default.
- W2616999522 countsByYear W26169995222018 @default.
- W2616999522 countsByYear W26169995222019 @default.
- W2616999522 countsByYear W26169995222020 @default.
- W2616999522 countsByYear W26169995222021 @default.
- W2616999522 countsByYear W26169995222022 @default.
- W2616999522 countsByYear W26169995222023 @default.
- W2616999522 crossrefType "journal-article" @default.
- W2616999522 hasAuthorship W2616999522A5006338687 @default.
- W2616999522 hasAuthorship W2616999522A5007857979 @default.
- W2616999522 hasAuthorship W2616999522A5028504321 @default.
- W2616999522 hasAuthorship W2616999522A5045316695 @default.
- W2616999522 hasAuthorship W2616999522A5061314483 @default.
- W2616999522 hasAuthorship W2616999522A5076675483 @default.
- W2616999522 hasAuthorship W2616999522A5090638822 @default.
- W2616999522 hasConcept C10138342 @default.
- W2616999522 hasConcept C127313418 @default.
- W2616999522 hasConcept C127413603 @default.
- W2616999522 hasConcept C162324750 @default.
- W2616999522 hasConcept C178790620 @default.
- W2616999522 hasConcept C179104552 @default.
- W2616999522 hasConcept C185592680 @default.
- W2616999522 hasConcept C191897082 @default.
- W2616999522 hasConcept C192562407 @default.
- W2616999522 hasConcept C27501479 @default.
- W2616999522 hasConcept C2776964284 @default.
- W2616999522 hasConcept C2776985018 @default.
- W2616999522 hasConcept C2780026712 @default.
- W2616999522 hasConcept C42360764 @default.
- W2616999522 hasConcept C54400483 @default.
- W2616999522 hasConcept C544778455 @default.
- W2616999522 hasConcept C71987851 @default.
- W2616999522 hasConcept C8058405 @default.
- W2616999522 hasConceptScore W2616999522C10138342 @default.
- W2616999522 hasConceptScore W2616999522C127313418 @default.
- W2616999522 hasConceptScore W2616999522C127413603 @default.
- W2616999522 hasConceptScore W2616999522C162324750 @default.
- W2616999522 hasConceptScore W2616999522C178790620 @default.