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- W2623097840 abstract "This work details how a neuromorphic system is simulated with a 3D integrated electronic system. The neural system is modeled as a 3D integrated circuit to investigate a highly efficient neuromorphic computing system that ameliorates implementation issues induced by prior 2D circuital systems. A 3D neuronal model incorporating the Through Silicon Via (TSV) is constructed and the performance is simulated. We maintain this work is a competent potential foundation towards a practical design methodology for producing 3D Neuromorphic Computing (NC) circuits and systems that function with lower power consumption, reduced delay, and more advanced system volumetric miniaturization than contemporary systems provide." @default.
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- W2623097840 date "2017-04-01" @default.
- W2623097840 modified "2023-09-26" @default.
- W2623097840 title "Hybrid three-dimensional integrated circuits: A viable solution for high efficiency Neuromorphic Computing" @default.
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- W2623097840 doi "https://doi.org/10.1109/vlsi-dat.2017.7939672" @default.
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