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• W2623479040 abstract "An innovative design and analysis procedure has been developed by The MacNeal-Schwendler Corporation (MSC) that enables the design engineer to perform analysis of Ball Grid Array (BGA) packages in an order of magnitude less time than was previously required by experienced analysts. This procedure captures the analytical expertise of the experienced analyst and makes it available to the design engineer with a minimum of training required. This is accomplished using MSC’s Acumen toolkit concept. MSC/Acumen is a unique programming procedure, which serves as an interface to the MSC/PATRAN preand post-processor. MSC/Acumen utilizes HTML programming to create the look and feel of a website devoted to a specific analytical problem. The expertise of the analyst as well as company procedures, processes and other, often proprietary, requirements, are captured by the MSC/Acumen developer. The design engineer creates the analytical model from icon picks and a selection of pre-defined model components. Material properties are contained in the MSC/Acumen program as well as loading conditions, boundary conditions, and other analytical requirements. The design engineer needs not have an understanding of finite-element analysis to create the models or apply the loading and boundary conditions. The loading sequence is also pre-defined based upon the procedures and practices developed by the analysts or experts responsible for detailed analytical evaluations of such components. Life prediction techniques based upon large strain and creep analysis are used to calculate the location of failure and the number of allowable loading cycles. These techniques are well justified by extensive fatigue data at one of the authors' laboratories at Yokohama National University. BACKGROUND Electronic packages such as Ball Grid Array, Flip-Chip, Chip Scale Packages, etc. are increasingly being reduced in size to obtain higher mounting density. Surface mount technology is increasing in complexity with the introduction of new alloys and designs. Operating parameters such as power requirements and temperature excursions are more severe as products are miniaturized on the one level while the duty cycle is increased. These changes in technology require that the materials of construction be pushed closer to design limits. Simultaneously, competition for market share requires that new products must be developed quickly to insure maximum profitability over the ever decreasing life span of products. Physical testing of new designs is often impossible due to the shortened development cycle and new products are now being introduced that have been created and verified entirely through computer simulation. GOALS OF PROJECT The main goals of this project are to demonstrate that the analytical expertise of the electronic packaging specialist can be captured, along with the design process, in such a way that the design engineer can utilize this expertise on a daily basis without extensive training. Previous experience with similar projects in other industries indicates that the evaluation of complex nonlinear designs can be reduced from weeks to hours by using MSC/Acumen as a communication medium. This process involves carefully understanding the design and analysis procedure and creating a knowledge-based system which uses a step-by-step tutorial type interface. The technology embedded in the program is based upon the latest research in the areas of solder characterization, material property data, fatigue life estimating and finite element modeling techniques. In each area of expertise, i.e., material property characterization, finite element modeling, etc., different specialists will contribute to the procedure so that it represents the accumulated knowledge of many experts. Thus, the resulting compilation is much more comprehensive than the knowledge of any one analyst, even one devoted entirely to the particular field. Thus, the design engineer, while limited to a specific area of design, will have the capability of creating a world-class design in an extremely short time span. Many design variations can be explored and part optimization can be accomplished in less time than a single design could be previously evaluated. Another benefit to the companies using the program is that consistent quality and confidence in the design is provided at all company locations, in all groups and by all individuals who use the software regardless of their experience or expertise. Of course, no software program will ever replace innovative designers who will invariably develop new and creative components using existing design parameters and procedures. TECHNICAL CHALLENGES The analytical evaluation of a BGA package involves a series of fairly complex analyses. A thermal analysis is necessary to calculate temperature distribution within the package and the attached components. Thermal stresses are induced by the difference in linear coefficients of expansion between the various components. The resulting stresses often exceed the yield point of the material, which requires an inelastic analysis. Creep, fatigue and other life prediction methods such as crack propagation and crack growth rate are necessary to determine the expected life of the various components. Simply obtaining material data, for example, can be time consuming and a source of error for the individual analyst. One of the most important features of this tool is the capability to add new features and capabilities as new information is obtained. Currently, all changes must be made by the software developers. However, future releases will allow customization by certain users within a company so that specialized procedures or policy decisions can be included or updated. CAPTURING EXPERTISE Probably the most important contribution of this software is the ability to capture the expertise of numerous specialists and the design procedure of the process. This requires bringing together a team consisting of experts in electronic package design materials and analytical methodology and programmers who are capable of developing commercial software. Using existing finite element solvers, modeling software and the MSC/Acumen web-based authoring toolkit, this expertise is captured in an interactive and intuitive environment. The MSC/PATRAN pre-and post processor is accused through the MSC/Acumen interface, thus allowing the programmer to utilize a wide range of modeling features. MSC/PATRAN PCL (PATRAN Command Language) is in itself a rich programming language which may be used to crate extensive parametric models. Additionally, MSC/PATRAN has considerable interface capability with other solvers and MCAD databases, which gives added flexibility to the overall process. SYSTEM ARCHITECTURE Figure 1 shows the system architecture of the program. MSC/Acumen BGA uses a program named Drive Page in order to call PCL functions and utilize MSC/PATRAN. This system is based on MSC/PATRAN, and consists of a Pre-Post system, a solver (MSC/AFEA), a material database, and a fatigue life test database. The main feature of the Pre-Post system is 3D modeling. MSC/MVISION, a material data management systen, will manage the two databases in the future, enabling easy maintenance for the databases. Moreover, MSC/Acumen BGA can handle various types of material data and fatigue life test data, since MSC/MVISION has an interface with MSC/PATRAN. Figure 1. System Architecture" @default.
• W2623479040 created "2017-06-15" @default.
• W2623479040 creator A5006037618 @default.
• W2623479040 creator A5012316990 @default.
• W2623479040 creator A5041740157 @default.
• W2623479040 creator A5046592236 @default.
• W2623479040 creator A5057613243 @default.
• W2623479040 creator A5080235829 @default.
• W2623479040 date "1999-12-01" @default.
• W2623479040 modified "2023-09-26" @default.
• W2623479040 title "Reliability analysis of BGA packages - a tool for design engineers" @default.
• W2623479040 cites W2106900365 @default.
• W2623479040 cites W2316811486 @default.
• W2623479040 cites W2428028193 @default.
• W2623479040 cites W571002254 @default.
• W2623479040 cites W2619862696 @default.
• W2623479040 hasPublicationYear "1999" @default.
• W2623479040 type Work @default.
• W2623479040 sameAs 2623479040 @default.
• W2623479040 citedByCount "1" @default.
• W2623479040 crossrefType "journal-article" @default.
• W2623479040 hasAuthorship W2623479040A5006037618 @default.
• W2623479040 hasAuthorship W2623479040A5012316990 @default.
• W2623479040 hasAuthorship W2623479040A5041740157 @default.
• W2623479040 hasAuthorship W2623479040A5046592236 @default.
• W2623479040 hasAuthorship W2623479040A5057613243 @default.
• W2623479040 hasAuthorship W2623479040A5080235829 @default.
• W2623479040 hasConcept C121332964 @default.
• W2623479040 hasConcept C127413603 @default.
• W2623479040 hasConcept C163258240 @default.
• W2623479040 hasConcept C191897082 @default.
• W2623479040 hasConcept C192562407 @default.
• W2623479040 hasConcept C199639397 @default.
• W2623479040 hasConcept C200601418 @default.
• W2623479040 hasConcept C41008148 @default.
• W2623479040 hasConcept C43214815 @default.
• W2623479040 hasConcept C50296614 @default.
• W2623479040 hasConcept C62520636 @default.
• W2623479040 hasConcept C77595967 @default.
• W2623479040 hasConcept C94709252 @default.
• W2623479040 hasConceptScore W2623479040C121332964 @default.
• W2623479040 hasConceptScore W2623479040C127413603 @default.
• W2623479040 hasConceptScore W2623479040C163258240 @default.
• W2623479040 hasConceptScore W2623479040C191897082 @default.
• W2623479040 hasConceptScore W2623479040C192562407 @default.
• W2623479040 hasConceptScore W2623479040C199639397 @default.
• W2623479040 hasConceptScore W2623479040C200601418 @default.
• W2623479040 hasConceptScore W2623479040C41008148 @default.
• W2623479040 hasConceptScore W2623479040C43214815 @default.
• W2623479040 hasConceptScore W2623479040C50296614 @default.
• W2623479040 hasConceptScore W2623479040C62520636 @default.
• W2623479040 hasConceptScore W2623479040C77595967 @default.
• W2623479040 hasConceptScore W2623479040C94709252 @default.
• W2623479040 hasLocation W26234790401 @default.
• W2623479040 hasOpenAccess W2623479040 @default.
• W2623479040 hasPrimaryLocation W26234790401 @default.
• W2623479040 hasRelatedWork W1488293465 @default.
• W2623479040 hasRelatedWork W1491363913 @default.
• W2623479040 hasRelatedWork W1962246115 @default.
• W2623479040 hasRelatedWork W1994178250 @default.
• W2623479040 hasRelatedWork W2052975474 @default.
• W2623479040 hasRelatedWork W2061458249 @default.
• W2623479040 hasRelatedWork W2105004207 @default.
• W2623479040 hasRelatedWork W2121174958 @default.
• W2623479040 hasRelatedWork W2164315891 @default.
• W2623479040 hasRelatedWork W2285093057 @default.
• W2623479040 hasRelatedWork W230891475 @default.
• W2623479040 hasRelatedWork W2651660233 @default.
• W2623479040 hasRelatedWork W2795664355 @default.
• W2623479040 hasRelatedWork W29651684 @default.
• W2623479040 hasRelatedWork W3155970252 @default.
• W2623479040 hasRelatedWork W611599818 @default.
• W2623479040 hasRelatedWork W64933279 @default.
• W2623479040 hasRelatedWork W73017928 @default.
• W2623479040 hasRelatedWork W2181365065 @default.
• W2623479040 hasRelatedWork W2598308653 @default.
• W2623479040 isParatext "false" @default.
• W2623479040 isRetracted "false" @default.
• W2623479040 magId "2623479040" @default.
• W2623479040 workType "article" @default.