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- W2625578049 abstract "Laserbonding is a newly developed technology that combines the flexibility and robustness of classical ultrasonic wire-bonding with the advantages of laser welding as regards large connector cross-sections, low quality requirements to surf aces and clamping rigidity. Thanks to modern laser sources with high brilliance, near-infrared radiation can be used in oscillation welding Cu even in a keyhole fashion even though Cu is traditionally considered illsuited for such laser wavelengths. The process is most useful for connecting copper ribbons of 2 × 0, 2 mm size to Li battery cells of the 18650 type but can also be adapted for larger prismatic cells. Further development is geared towards connecting power semiconductors." @default.
- W2625578049 created "2017-06-23" @default.
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- W2625578049 date "2017-04-01" @default.
- W2625578049 modified "2023-09-26" @default.
- W2625578049 title "Laserbonding instead of ultrasonic wire bonding — An alternative joining technology for power applications" @default.
- W2625578049 doi "https://doi.org/10.23919/icep.2017.7939332" @default.
- W2625578049 hasPublicationYear "2017" @default.
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