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- W2627055554 abstract "The aim of this study is to investigate the effect of aging and test temperature on adhesion strength of the resin (bisphenol F-type epoxy resin)/Cu interface. The adhesion strength of the Cu joint with the resin was investigated by the tensile test. The tensile test was conducted at a tensile rate of 0.1 mm/s. Tensile strength was 8.9 MPa before aging and it gradually decreased with aging at 175 °C and fell to half or less after aging for 1000 h. Tensile strength and fracture strain decreased with increasing test temperature. The fracture occurred mainly at the adhesion interface. At the temperature above glass transition temperature of resin material, the interface strength decreased." @default.
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- W2627055554 date "2017-04-01" @default.
- W2627055554 modified "2023-09-25" @default.
- W2627055554 title "Effect of aging and test temperature on adhesion strength of copper and epoxy resin" @default.
- W2627055554 cites W2019398752 @default.
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- W2627055554 doi "https://doi.org/10.23919/icep.2017.7939448" @default.
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