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- W2644025475 abstract "This paper describes approaches for 3D integration of CMOS and MEMS sensors. It implies methods for wafer level packaging, Through-Silicon-Vias (TSV) and novel methods for heterogeneous system integration like micro-transfer-printing. These technologies are described on sensor devices." @default.
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- W2644025475 date "2017-05-01" @default.
- W2644025475 modified "2023-10-04" @default.
- W2644025475 title "Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors" @default.
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- W2644025475 doi "https://doi.org/10.23919/ltb-3d.2017.7947409" @default.
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