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- W2645517943 abstract "In this study, Cu-Cu bonding with pillar-concave structure on a polymer layer was investigated to realize better bonding quality at lower temperature, while a low-stress release layer for temporary bond and de-bond by laser ablation was demonstrated to handle a glass panel for re-distribution layer (RDL) process. The low temperature technology can be potentially applied for RDL-first fan-out panel level package (FOPLP)." @default.
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- W2645517943 date "2017-05-01" @default.
- W2645517943 modified "2023-09-22" @default.
- W2645517943 title "Study on low temperature Cu bonding and temporary bond/de-bond for RDL-first fan-out panel level package" @default.
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- W2645517943 doi "https://doi.org/10.23919/ltb-3d.2017.7947414" @default.
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