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- W2655305404 abstract "Wafer-level packaging is one of the most important aspects in manufacturing of sensor and microelectromechanical system (MEMS) devices. It determines the cost, yield, reliability, and long-term stability of these devices. In recent years, low-temperature wafer bonding has become a very important packaging and sealing technology for the realization of advanced devices integrated with dissimilar materials. This paper focuses on low temperature sealing technologies (< 200°C) using metal thin films and solders and reviews the state-of-the-art low-temperature sealing technologies." @default.
- W2655305404 created "2017-06-30" @default.
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- W2655305404 date "2016-01-01" @default.
- W2655305404 modified "2023-09-30" @default.
- W2655305404 title "A Review of Low-temperature Sealing Technologies using Metal Thin Films and Solders for Sensors and MEMS" @default.
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- W2655305404 doi "https://doi.org/10.1541/ieejsmas.136.266" @default.
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