Matches in SemOpenAlex for { <https://semopenalex.org/work/W2694896962> ?p ?o ?g. }
- W2694896962 endingPage "614" @default.
- W2694896962 startingPage "575" @default.
- W2694896962 abstract "Technological innovations in manufacturing processes are critical for devices that require high-quality thick piezoelectric ceramic films. However, ceramic films synthesized by conventional methods usually suffer from mechanical failures, poor adhesion, reliability, and rough interfaces. Furthermore, with traditional piezoelectric thin film methods, such as sputtering, sol-gel, pulsed laser, and etc., it is difficult to synthesize piezoelectric films with complex material compositions and with multiple dopants in a short deposition time and over a large surface area, in general. The aerosol deposition (AD) process is a unique approach for depositing thick piezoelectric ceramic films to overcome these technological hurdles. In this process, (sub)-micron ceramic particles fluidized by gas flow are accelerated in a low-vacuum environment at velocities of up to 100–300 m/s to be impacted on the desired substrates. The impact results in a thick, dense, uniform, and homogeneous polycrystalline ceramic film formed at room temperature without the need for any additional heating to solidify the resulting film. The process is extremely cost-effective and requires comparatively simple equipment installation that is integratable with modern industrial fabrication facilities. This technique is particularly useful for fabricating piezoelectric thick films for microactuators, sensors, and energy-harvesting devices. This chapter describes the mechanisms and features of the AD process, followed by applications of AD for fabricating piezoelectric materials and devices." @default.
- W2694896962 created "2017-06-30" @default.
- W2694896962 creator A5003310903 @default.
- W2694896962 creator A5026772417 @default.
- W2694896962 creator A5086756156 @default.
- W2694896962 creator A5091264966 @default.
- W2694896962 date "2017-01-01" @default.
- W2694896962 modified "2023-09-27" @default.
- W2694896962 title "Aerosol Deposition (AD) and Its Applications for Piezoelectric Devices" @default.
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- W2694896962 cites W612189167 @default.
- W2694896962 doi "https://doi.org/10.1016/b978-0-08-102135-4.00015-1" @default.
- W2694896962 hasPublicationYear "2017" @default.
- W2694896962 type Work @default.
- W2694896962 sameAs 2694896962 @default.
- W2694896962 citedByCount "7" @default.
- W2694896962 countsByYear W26948969622019 @default.
- W2694896962 countsByYear W26948969622020 @default.
- W2694896962 countsByYear W26948969622021 @default.
- W2694896962 crossrefType "book-chapter" @default.
- W2694896962 hasAuthorship W2694896962A5003310903 @default.
- W2694896962 hasAuthorship W2694896962A5026772417 @default.
- W2694896962 hasAuthorship W2694896962A5086756156 @default.
- W2694896962 hasAuthorship W2694896962A5091264966 @default.
- W2694896962 hasConcept C100082104 @default.