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- W2703380450 abstract "To manufacture high-performance heterostructured semiconductor devices inexpensively, we investigated the correlation among conditions of surface treatment, particle density, and bonding strength in non-cleanroom environment. We systematically examined schemes of cleaning wafers, hydrophilic / hydrophobic treatments, and conditions of bonding, and obtained strong bonds sufficient in device use." @default.
- W2703380450 created "2017-06-30" @default.
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- W2703380450 date "2017-05-01" @default.
- W2703380450 modified "2023-09-26" @default.
- W2703380450 title "Understanding the environmental influence on semiconductor wafer bonding" @default.
- W2703380450 doi "https://doi.org/10.23919/ltb-3d.2017.7947477" @default.
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