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- W2707418166 abstract "This paper presents an experimental investigation of ductile cutting of silicon by using a diamond tool with a negative rake angle. A diamond cutting tool with a zero rake angle is inclined to form a negative rake angle for a better performance in ductile cutting. A high-sensitivity force sensor is integrated with the tool holder for detection of the tool-sample contact and monitoring the thrust force in the cutting process. The unavoidable sample tilt was probed by using the force sensor integrated diamond tool as a stylus, so that microstructures can be directly fabricated along the tilted workpiece. With accurate tilt compensation, a microstructure array with a good uniformity was successfully fabricated on the silicon surface." @default.
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- W2707418166 date "2015-01-01" @default.
- W2707418166 modified "2023-10-14" @default.
- W2707418166 title "0706 uctile Cutting of a Microstructure Array on Silicon Surface by Using a Diamond Tool with a Negative Rake Angle" @default.
- W2707418166 doi "https://doi.org/10.1299/jsmelem.2015.8._0706-1_" @default.
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