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- W2723948019 abstract "This study provides creep properties of lead free solder alloy Sn-3Ag-0.5Cu based on both methods of relaxation and indentation under constant room temperature condition. Small solder specimens with rectangular cross-section were applied for relaxation method. Indentation creep properties were evaluated by Nano-Indenterunder constant room temperature of 28℃.Dependence of creep index on indentation force was clarified experimentally. Creep index slightly decreases with increase of applied load. The average of creep index based on relaxation method was agreement with one based on indentation method. Experimental results showed mechanical properties for creep and elastic properties." @default.
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- W2723948019 date "2013-01-01" @default.
- W2723948019 modified "2023-09-26" @default.
- W2723948019 title "20117 Evaluation of Mechanical properties of Lead-Free Solder on Small Specimen" @default.
- W2723948019 doi "https://doi.org/10.1299/jsmekanto.2013.19.219" @default.
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