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• W2731641751 abstract "A nondestructive method of ultrasonic fault localization of IC interconnection without mold decapsulation was proposed instead of the optical-beam-induced resistance change (OBIRCH) method. The signal principle of the proposed method is based on the resistance change induced by local ultrasonic heating. To investigate the principle, numerical analysis constructed by sound and temperature field simulations is carried out and its results were compared with experimental results. The sound field is calculated by Fourier analysis. The temperature field is discretized using an equivalent thermal network circuit. Numerical simulation results show a good agreement with experimental results, suggesting that the signal in the proposed method was induced by ultrasonic heating. Moreover, ultrasonic heating induced the signal of the proposed method in a sample covered with commercially available resin including fillers (average diameter: 16 µm), and electro-static discharge (ESD) damage was localized by ultrasonic heating without mold decapsulation. These results suggest that the signal induced by ultrasonic stimulation is detectable and available for use in analysis." @default.
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• W2731641751 date "2017-06-27" @default.
• W2731641751 modified "2023-09-23" @default.
• W2731641751 title "Nondestructive fault localization of IC interconnection by using ultrasonic heating" @default.
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• W2731641751 doi "https://doi.org/10.7567/jjap.56.07jc11" @default.
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