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- W2733642343 abstract "In this study, we examine the growth of a 〈111〉-oriented Cu layer on a thin TaWN ternary alloy barrier for good electromigration reliability. The strongly preferentially oriented Cu(111) layer is observed on a thin TaWN barrier even in the as-deposited Cu (100 nm)/TaWN (5 nm)/Si system. Also, this system tolerates annealing at 700 °C for 1 h without silicide reaction. It is revealed that the TaWN film is one of the excellent barriers with thermal stability and low resistivity. Simultaneously, the TaWN film is a candidate for a superior underlying material to achieve the Cu(111) preferential orientation." @default.
- W2733642343 created "2017-07-14" @default.
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- W2733642343 date "2017-06-29" @default.
- W2733642343 modified "2023-09-26" @default.
- W2733642343 title "Growth of 〈111〉-oriented Cu layer on thin TaWN films" @default.
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- W2733642343 doi "https://doi.org/10.7567/jjap.56.07kc03" @default.
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